AptarGroup. has been granted a patent for an apparatus designed for packaging integrated circuits. The apparatus features a reel, a carrier tape with cavities for the circuits, and a cover tape. Notably, the carrier tape incorporates a desiccant entrained polymer to enhance moisture control. GlobalData’s report on AptarGroup gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on AptarGroup, Smart inhalers was a key innovation area identified from patents. AptarGroup's grant share as of June 2024 was 63%. Grant share is based on the ratio of number of grants to total number of patents.

Packaging apparatus for integrated circuits with desiccant properties

Source: United States Patent and Trademark Office (USPTO). Credit: AptarGroup Inc

The patent US12035478B2 describes an innovative apparatus designed for the packaging of integrated circuits. Central to this apparatus is a reel and a carrier tape that is wrapped around it, featuring multiple cavities specifically designed to securely hold integrated circuits. Each cavity is covered by a tape that retains the integrated circuit and forms an enclosed compartment. A notable aspect of the carrier tape is its composition, which includes a desiccant entrained polymer. This polymer is a monolithic blend of a base polymer, a molecular sieve desiccant, and a polymeric channeling agent that enhances water vapor transmission. The desiccant is present in varying concentrations, ranging from 15% to 70% by weight, ensuring effective moisture control within the packaging.

The patent further outlines various configurations and processes for creating this packaging apparatus. It includes methods for extruding, thermoforming, or molding the carrier tape to incorporate the desiccant entrained polymer. Additionally, the design allows for the possibility of a transparent cover tape section, enabling visibility of printed information on the integrated circuits stored within. The apparatus can also feature multiple layers, with an outer barrier layer and an inner layer containing the desiccant polymer. The claims emphasize the versatility of the manufacturing process, which can involve coextrusion or heat staking to adhere the desiccant film to the carrier or cover tape. Overall, this patent presents a comprehensive solution for the effective packaging of integrated circuits, addressing both structural integrity and moisture management.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.