Toyo Seikan Group has patented a roll-bonded laminate with an ultrathin metal layer to prevent wrinkles and cracks. The laminate consists of a peelable carrier layer, ultrathin metal layer, and metallic foil, with the ultrathin metal layer thickness ranging from 0.5 µm to 20 µm. GlobalData’s report on Toyo Seikan Group gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Toyo Seikan Group, Fuel cell powered drones was a key innovation area identified from patents. Toyo Seikan Group's grant share as of May 2024 was 47%. Grant share is based on the ratio of number of grants to total number of patents.
Ultrathin metal layer lamination without wrinkles, cracks
A recently granted patent (Publication Number: US11999131B2) discloses a roll-bonded laminate structure comprising a peelable carrier layer, an ultrathin metal layer, and a metallic foil. The ultrathin metal layer, with a thickness ranging from 0.5 µm to 20 µm, is bonded to the carrier layer via a peel layer, ensuring a peel strength between the two layers within the range of 0.1 N/20 mm to less than 1 N/20 mm. Additionally, the laminate may include intermediate layers of metal between the ultrathin metal layer and the metallic foil, with the peel strength between the ultrathin metal layer and the metallic foil surpassing that between the carrier layer and the ultrathin metal layer.
Furthermore, the patent describes a method for producing the roll-bonded laminate, involving the lamination of at least two layers, including the ultrathin metal layer and metallic foil. The ultrathin metal layer, which can be copper or other specified metals, is applied using wet or dry film formation methods, with a controlled thickness of 0.5 µm to 20 µm. The metallic foil, composed of metals like aluminum or copper, is roll-bonded to the ultrathin metal layer, ensuring a standard deviation of less than 1 µm in the ultrathin metal layer's thickness. Variants of the laminate may feature a copper layer with a thickness ranging from 1 µm to 7 µm, catering to specific application requirements.
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