Intel’s campus in Rio Rancho, New Mexico. Credit: Walden Kirsch / Intel.

Multinational technology company Intel has revealed plans for a $3.5bn multi-year investment in its manufacturing facility in Rio Rancho, New Mexico.

The investment will be used to upgrade the facility to support the development of advanced chip packaging technologies, including Intel’s Foveros 3D packaging technology.

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Using Foveros, the company will be able to develop processors with computer tiles vertically stacked in three dimensions, instead of spreading out flat in two dimensions.

The advanced packaging technology allows the company to mix and match computer tiles, with the aim of providing performance and power efficiency in a smaller form.

The Rio Rancho expansion project will generate at least 700 jobs in the next three years. It is also expected to create 1,000 construction jobs and support another 3,500 jobs in New Mexico.

Planning activities for the project have started and construction is due to begin later this year.

Intel manufacturing and operation senior vice-president and general manager Keyvan Esfarjani said: “A key differentiator for our IDM 2.0 strategy is our unquestioned leadership in advanced packaging, which allows us to mix and match compute tiles to deliver the best products.

“We’re seeing tremendous interest in these capabilities from the industry, especially following the introduction of our new Intel Foundry Services. We’re proud to have invested in New Mexico for more than 40 years and we see our Rio Rancho campus continuing to play a critical role in Intel’s global manufacturing network in our new era of IDM 2.0.”

The company, which began operations in New Mexico in 1980, currently employs more than 1,800 people at the facility and has already invested $16.3bn to support operations.

Last October, Intel Federal secured the second phase of the US Department of Defence’s State-of-the-Art Heterogeneous Integration Prototype programme.

The company offered its advanced heterogeneous packaging technologies, including the embedded multi-die interconnect bridge (EMIB), 3D Foveros and Co-EMIB (which combines the EMIB and Foveros), for the programme.