KLA’s new Kronos 1190 wafer inspection system, ICOS F160XP die sorting and inspection system and the next generation of the ICOS T3/T7 Series of component inspection systems are designed to address a wide variety of IC packaging challenges. Credit: PRNewsfoto/ KLA Corporation.

US-based capital equipment company KLA has enhanced its systems portfolio for advanced packaging with the launch of new tools.   

The new tools include the Kronos 1190 wafer-level packaging inspection system, the ICOS F160XP and the ICOS T3/T7 Series.

Go deeper with GlobalData

Data Insights

The gold standard of business intelligence.

Find out more

Related Company Profiles

View all

The systems will allow the customers to advance semiconductor device fabrication at the packaging stage. They will support the customers to overcome a broad range of integrated circuit (IC) challenges.

Kronos 1190 is designed to offer inline process control for advanced wafer-level packaging process steps and the ICOS F160XP performs inspection and die sorting after wafer-level packages are tested and diced.

The ICOS T3/T7 Series are designed to address varying inspection needs throughout the packaging assembly process.

KLA Electronics, Packaging and Components (EPC) group executive vice-president Oreste Donzella said: “Process control across all stages of packaging manufacturing, from wafer- to component-level process steps, becomes more critical as innovations continue to advance packaging technology.

How well do you really know your competitors?

Access the most comprehensive Company Profiles on the market, powered by GlobalData. Save hours of research. Gain competitive edge.

Company Profile – free sample

Thank you!

Your download email will arrive shortly

Not ready to buy yet? Download a free sample

We are confident about the unique quality of our Company Profiles. However, we want you to make the most beneficial decision for your business, so we offer a free sample that you can download by submitting the below form

By GlobalData
Visit our Privacy Policy for more information about our services, how we may use, process and share your personal data, including information of your rights in respect of your personal data and how you can unsubscribe from future marketing communications. Our services are intended for corporate subscribers and you warrant that the email address submitted is your corporate email address.

“Our newly launched products help device manufacturers, foundries and outsourced semiconductor and test (OSAT) providers meet expectations for quality and reliability in an increasingly diverse and complex packaging segment.

“At KLA, we see a unique opportunity to leverage our 40+ year history of innovating semiconductor front-end fabrication technologies to further accelerate packaging yield through advanced process control solutions.”

In May this year, KLA formed the EPC businesses to support KLA’s leadership in systems and services across the semiconductor and microelectronics value chain.