US-based Rudolph Technologies has received orders for the supply of seven Firefly Inspection Systems to two undisclosed companies that offer advanced packaging manufacturing services and an outsourced assembly and test (OSAT) facility.

The Firefly Systems will be used for fan-out and wafer-level chip scale packaging (WLCSP) applications.

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Powered by Rudolph’s patented Clearfind technology, the Firefly System can detect critical defects that are almost impossible to find using conventional imaging techniques.

The system also helps to reduce yield-robbing failures in both the front and back-end of the semiconductor manufacturing process.

"Advanced packaging is rapidly becoming a critical differentiator for mobile and Internet of Things (IoT) device manufacturers with growth in multiple technology segments."

Rudolph Technologies Process Control Group vice-president and general manager Mike Goodrich said: “Advanced packaging is rapidly becoming a critical differentiator for mobile and Internet of Things (IoT) device manufacturers with growth in multiple technology segments.

“This includes fan-out wafer level packaging, which YoleDéveloppement estimates will have a compound annual growth rate as high as 50% over the next three years.

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“We are excited to enable this rapid growth in advanced packaging through reduced cost and improved reliability of next generation technologies with our new Firefly inspection solution.”

The company also noted that its Firefly System offers a combination of defect sensitivity and substrate flexibility in a single platform, allowing customers to reduce their capital investments.

When combined with Rudolph’s automatic defect classification TrueADC software and yield management Discover software, the Firefly systems delivers a complete solution for process control and quick yield learning at critical steps in advanced packaging processes.