BERHALTER Swiss Die-Cutting, a global leader in high-performance die-cutting technology, is excited to announce its participation in PACK EXPO International 2024, taking place at McCormick Place, Chicago, from November 3-6, 2024. This premier industry event will bring together top professionals in packaging and processing for three days of live demonstrations, technological innovations, and networking opportunities.
Agenda Highlights:
At Booth #N-5680, BERHALTER Swiss Die-Cutting will be showcasing its most advanced die-cutting solutions, offering live demonstrations and expert consultations. Key highlights include:
- Exclusive Live Demonstrations: Attendees will witness the power and precision of the BERHALTER Swiss Die-Cutter B6, capable of up to 500 strokes per minute. This cutting-edge machine sets new benchmarks for speed, efficiency, and accuracy in die-cutting.
- CUTcontrol™ IIoT Platform: Discover how the intelligent IIoT platform, CUTcontrol™, provides real-time data, enabling predictive maintenance and improving operational efficiency. Learn how this platform can streamline production lines and minimize downtime.
- Meet Our Experts: Dalibor Schuman, Reto Frei, and Gregory Frei will be available at our booth to provide insights into how our solutions can optimize your die-cutting processes, boost productivity, and reduce costs.
Why You Should Attend:
For professionals in packaging, die-cutting, and manufacturing, PACK EXPO International 2024 is the perfect opportunity to discover the latest advancements in the industry. Attendees will benefit from:
- First Access to New Technologies: Get an exclusive look at the latest innovations in die-cutting, from high-speed cutting to digital platforms designed to maximize production efficiency.
- Personalized Consultations: Our team of experts will be on-site to offer tailored advice and solutions to meet your specific production challenges.
- Networking Opportunities: Connect with industry leaders, exchange ideas, and gain valuable insights into the trends shaping the future of the packaging and processing industries.
Quotes:
“We are looking forward to showcasing our cutting-edge solutions at PACK EXPO International 2024,” said Dalibor Schuman, Managing Director of BERHALTER Swiss Die-Cutting. “This event provides a fantastic platform for us to demonstrate how our technologies can help businesses improve efficiency, sustainability, and competitiveness in today’s fast-paced market.”
Event Details:
- Date: November 3-6, 2024
- Location: McCormick Place, Chicago, Illinois
- Booth No: N-5680
For more information about the event or to schedule a meeting with our team, please visit https://www.berhalter.red/company/#team
About BERHALTER Swiss Die-Cutting:
BERHALTER Swiss Die-Cutting is a leading provider of high-performance die-cutting technology, offering innovative solutions for the packaging, labeling, and materials processing industries. With a focus on precision and efficiency, BERHALTER continues to drive advancements that help businesses enhance their operations.
For media inquiries, please contact:
BERHALTER Swiss Die-Cutting
A Division of BERHALTER AG
9443 Widnau | Switzerland
die-cutting@berhalter.red
www.berhalter.red
Referral link:
https://www.berhalter.red/swiss-die-cutter-b6/